Current Issue in Engineering

MAESC 1999 Proceedings

  • Siripong Malasri Dean of Engineering, Healthcare Packaging Consortium Director, Christian Brothers University, 650 East Parkway South, Memphis TN 38104, USA

Abstract

October 1998


CHAIRMAN’S MESSAGE


Dear Fellow Memphis-Area Engineers:

I am very pleased to announce the Memphis-Area Engineering Societies Conference (MAESC), the first of its kind in Memphis. MAESC is being sponsored by various local engineering organizations, which are listed elsewhere in this brochure.

The growth of Memphis and the surrounding area is largely dependent on the strength of our engineering community. The more we can enhance our engineering talents through both industry and education, the better the chance more industries will be attracted to this region.

This conference presents us with many opportunities a chance for us to share our expertise and discuss current issues in engineering. It will also be an excellent opportunity for continuing education. In addition, the bonds of our local engineering organizations will be strengthened. We are at the turn of the century time to prepare for the next millennium.

I would like to thank the various sponsors for their support. Also, special thanks go to Jeff Talley of ASME and Arthur Eberle of AIChE for taking a leadership role in co-chairing the MAESC 1999 Advisory Board. Many thanks are due to the Organizing Committee members, who have big tasks ahead for the next several months.

On behalf of Christian Brothers University, we are delighted to have this opportunity to host the conference. You will hear more from us at various stages as we progress through the preparations for MAESC 1999. We look forward to your support and participation.

Siripong Malasri, Ph.D., P.E.
MAESC 1999 Chair

Published
May 13, 1999
How to Cite
MALASRI, Siripong. Current Issue in Engineering. IESTOC, [S.l.], v. 1, n. 1, p. 1-339, may 1999. Available at: <https://iestoc.org/index.php/conference/article/view/12>. Date accessed: 29 mar. 2024.
Track
Healthcare Packaging Consortium Meetings